热/UV纳米压印设备 NI-1000

1.尺寸:1200x1200x1800(mm) 重量:700kg

2.基本性能

适合低温工程的ＵＶ纳米压印，真空中实现亚微细米级的高精度调节。可实现在ＵＶ纳米压印必需的均一ＵＶ照射机能和低粘度树脂对应的微小加压控制，同时真空中可防止气泡发生。通过各种设定可选择手动或全自动的热/ＵＶ式压印。
Size of wafer and stamper: φ50mm
Temperature: 60~200℃
Imprint pressure :2~2000N
Head feeding resolution: 0.1µm
User interface: Windows based interface

3.选择设定

Alignment: Manual - Precision: ±5µm (Air)
Alignment: Fully automated - Using image processing and piezoelectric actuator - Precision: ±0.5µm (Vacuum)
UV exposure: Uniform exposure by scanning
Vacuum: Vacuum chamber and rotary pump - 5Pa
Turbo molecular pump: 1x30-3Pa
High response/high temperature ceramic heater: 650℃
Soft pressure head: 20g
High pressure head: 10kN

4.其他性能

Power: 200V 50A
Compressed air: 0.5MPa

桌面型纳米压印设备 NI-1075
基本性能及设备结构

1.尺寸:1260x750x560(mm)不包括突起部分 重量:大约190kg

2.基本性能

桌面型纳米压印设备NI-1075是一套专门用于研究开发的超级小型热纳米压印设备.它能准确地控制工程系数:模子/衬底温度,模子压印负荷及模子压印位移.如把成形部由真空室密闭,可执行真空环境中的纳米压印工程.这套设备因为可以把模子和衬底最高加热到650摄氏度,所以不仅可用于树脂材料而且可用于玻璃材料执行纳米压印工程实验．
Max. temperature: 650℃
Max. heating time: 10sec. (RT→250℃) or 30sec. (RT→650℃)
Cooling: Natural cooling
Efficient imprint area: 50mmx50mm
Temperature distribution in the heater surface: Max. 1% (200℃)
Max. imprint force: 10kN
Head travel resolution ability: 0.1µm
Parallelization of the pressurization surface: Manual
Process control: Automatic (lad control and displacement control) and manual

3.设备结构

本体部: 执行纳米压印工程．
输入部: 输入工程条件，指令工程实行和停止.监视本体部的运转状态.与本体部通过伸缩性专用固定台连接.
真空泵部(没图解): 在真空环境中执行压印工程时使用的真空废气设备.与本体部真空室通过真空管连接．

桌面型纳米压印设备 NI-273
基本性能及设备结构

1.尺寸:1260x750x560(mm)不包括突起部分 重量:大约190kg

2.基本性能

基本上跟NI-1075同样. 差异如下.
Efficient imprint area: 25mmx25mm
Max. imprint force: 2kN

3.设备结构

跟NI-1075同样.

滚杠式纳米压印设备
基本做法及模子样品

1.尺寸:750(W)x560(D)x890(H)(mm) 重量:200kg

2.基本做法

滚杠式纳米压印设备执行高精度热纳米压印工程.
Max. temperature: 200℃
Max. heating time: 60sec. (RT→200℃)
Cooling: Natural cooling
Efficient imprint area: 85mmx85mm and more
Temperature distribution in the heater surface: Max. 5% (200℃)
Max. imprint force: 2kN
Head travel resolution ability: 0.1µm
Parallelization of the pressurization surface: Manual
Process control: Automatic (lad control) and manual

3.模子样品